The advent of the laser micromachining era shows the retreat of another era. Since the advent of the first laser in 1996, the recognition and affirmation of laser micromachining technology in the 21st century, especially in the past 20 years, laser manufacturing technology has completely penetrated into many high-tech fields and industries, and replaced some traditional processing industries.
Tracing back to the source of laser micromachining, it has to originate from semiconductor manufacturing processes. The concept of micromachining means that it is very fine in terms of structure, function, and performance, and it is even better in terms of precise dimensions and fine machining. Therefore, when used in semiconductor manufacturing processes, traditional micromachining technology cannot satisfy semiconductor IC processing processes at all. Laser micromachining technology is different from traditional machining technology. Whether it is from laser welding , cutting, drilling, surface modification, etc., it is superior to traditional technology and has unsurpassed performance.
Laser micromachining technology has been widely concerned in the past ten years. In the future, the innovation and development of laser micromachining technology will be applied to all aspects of life. In the process of processing several to hundreds of sizes, only laser micromachining equipment can do it. The width of the laser pulse is between femtosecond and nanosecond, which is one of the "micro" of laser micromachining.
Laser micromachining principle
We are well aware of the field of laser micromachining. From a wide range, laser micromachining is mainly used in the following three fields: microelectronics, micromechanics, and microoptics. In a small scope, laser micromachining technology will be applied to micromachining lasers for cutting, drilling, engraving, scribing, thermal penetration, welding, etc. in equipment manufacturing, automotive and aviation precision manufacturing and various microprocessing industries. For example, modern mobile phones and digital cameras have about 1200 interconnects per square centimeter. The key to improving the level of chip packaging is to preserve the existence of micro vias between different layers of circuits. In this way, the micro vias not only provide a high-speed link between surface-mounted devices and the signal panel below, but also effectively reduce the packaging. area.
Laser micromachining enriches our lives. From its own perspective, laser micromachining has high production efficiency, low cost, stable and reliable processing quality, and good economic and social benefits.
As a laser micromachining equipment, wafer laser dicing machine has the following advantages:
1 laser system;
2 external light path system;
3XYθ three-axis fine motion system
4 robot loading and unloading system
5Dual CCD automatic identification and positioning system
6Auto Focus System
7Exhaust dust removal system (purification)
8 logic control system
9 Granite Pedestal Platform
What kind of wafer samples can the nine advantage sets create together? Look and be amazed!